Design Capabilities / Core Technology
We tailor solutions for diverse space missions, integrating hardware to software strengths. Our highly customizable offerings precisely align with your unique requirements.
Image Sensor
- Optical Sensor
- LWIR Sensor
- SWIR Sensor
FPGA and Processor
- AMD SOC
- Nvidia Embedded System
- Xilinx
- MicroSemi
Image Data
Processing Algorithms
- TDI (Time Delay Integration)
- AI (Artificial Intelligence)
- Deep Learning
Image Data Compression
- H.264 LIKE
- CCSDS
Image Remote Sensing Payload System for space application
Production Capacity
Our production capacities ensure that the products meet the different standards they require, especially for the modules working in space.
Environmental Testing
- TVC (Thermal Vacuum Cycle)
- MIL-STD-461G (EMI and EMC Standards)
- Radiation Test (10 Krad)
- Vibration
IPC Class 3 Production Process
Stacking / Coating
Lead / Lead-Free Assembly
